The smartphone carries a model number SM-G991U and the motherboard is code name “lahaina” which refers to Qualcomm’s latest Snapdragon 888 chipset. The device manages to score modest results with 1,075 points in the single-core and 2,916 points in the multi-core test.
The newly arrived flagship Snapdragon 888 chipset Cortex-X1 core can execute 33% more instruction per clock than Cortex-A78. The chipset integrates Adreno 660 GPU which is 35% faster than its predecessor. It has a third-generation Qualcomm Snapdragon X60 5G modem that supports both mmWave and sub-6 networks across all major bands worldwide.
The CAD renders for the Galaxy S21 shows a triple vertical camera setup on the back. The front panel could be flat and features a punch-hole cutout to house the selfie camera. A recent leak suggests that the Galaxy S21 lineup will be announced on January 14. Other than the Galaxy S21, the lineup is expected to include Galaxy S21+ and Galaxy S21 Ultra.
